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Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam (2020)

First Author: He H

Attributed to: Novel Brazing Filler Metals using High Entropy Alloys funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.matlet.2020.128642

Publication URI: http://dx.doi.org/10.1016/j.matlet.2020.128642

Type: Journal Article/Review

Parent Publication: Materials Letters