On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls (2020)
Attributed to:
Study of Nucleation and Solidification of Sn-based Lead-Free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08508-w
Publication URI: http://dx.doi.org/10.1007/s11664-020-08508-w
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 3