On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls (2020)

First Author: Daszki A
Attributed to:  Study of Nucleation and Solidification of Sn-based Lead-Free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08508-w

Publication URI: http://dx.doi.org/10.1007/s11664-020-08508-w

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 3