Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony (2020)

First Author: Belyakov S
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08507-x

Publication URI: http://dx.doi.org/10.1007/s11664-020-08507-x

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 3