Tooling and procedures for hybrid integration of lasers by flip-chip technology (2020)
Attributed to:
Silicon Photonics for Future Systems
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/estc48849.2020.9229661
Publication URI: http://dx.doi.org/10.1109/estc48849.2020.9229661
Type: Conference/Paper/Proceeding/Abstract