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Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging (2021)

First Author: Liu G

Attributed to: Novel GaN Power Devices and Packaging Technologies for 300C Ambient Operation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2020.3046917

Publication URI: http://dx.doi.org/10.1109/tcpmt.2020.3046917

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 3