Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging (2021)
Attributed to:
Novel GaN Power Devices and Packaging Technologies for 300C Ambient Operation
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2020.3046917
Publication URI: http://dx.doi.org/10.1109/tcpmt.2020.3046917
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 3