High Entropy Alloys as Filler Metals for Joining. (2021)
Attributed to:
Novel Active Soldering; Creating Enhanced joints Near-ambient Temperature (NASCENT)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.3390/e23010078
PubMed Identifier: 33430183
Publication URI: http://europepmc.org/abstract/MED/33430183
Type: Journal Article/Review
Volume: 23
Parent Publication: Entropy (Basel, Switzerland)
Issue: 1
ISSN: 1099-4300