Laser-assisted grinding of reaction-bonded SiC (2020)
Attributed to:
Miniature Flexible & Reconfigurable Manufacturing System for 3D Micro-products
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1177/2516598420965342
Publication URI: http://dx.doi.org/10.1177/2516598420965342
Type: Journal Article/Review
Parent Publication: Journal of Micromanufacturing
Issue: 2