The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures (2021)

First Author: Gu T
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08697-4

Publication URI: http://dx.doi.org/10.1007/s11664-020-08697-4

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 3