Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections (2019)

First Author: Belyakov S
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.23919/icep.2019.8733493

Publication URI: http://dx.doi.org/10.23919/icep.2019.8733493

Type: Conference/Paper/Proceeding/Abstract