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Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability (2018)

First Author: Belyakov S

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.23919/icep.2018.8374705

Publication URI: http://dx.doi.org/10.23919/icep.2018.8374705

Type: Conference/Paper/Proceeding/Abstract