Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability (2018)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.23919/icep.2018.8374705
Publication URI: http://dx.doi.org/10.23919/icep.2018.8374705
Type: Conference/Paper/Proceeding/Abstract