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Tailoring the Cu6Sn5 layer texture with Ni additions in Sn-Ag-Cu based solder joints (2018)

First Author: Hsu Y

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546474

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546474

Type: Conference/Paper/Proceeding/Abstract