Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification (2018)

First Author: Xian J
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4028/www.scientific.net/ssp.273.66

Publication URI: http://dx.doi.org/10.4028/www.scientific.net/ssp.273.66

Type: Journal Article/Review

Parent Publication: Solid State Phenomena