Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles (2020)

First Author: Li M
Attributed to:  Novel manufacturing methods for functional electronic textiles funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s00542-020-04813-w

Publication URI: http://dx.doi.org/10.1007/s00542-020-04813-w

Type: Journal Article/Review

Parent Publication: Microsystem Technologies

Issue: 6