Integrated Devices for Micro-Package Integrity Monitoring in mm-Scale Neural Implants (2018)
Attributed to:
Empowering Next Generation Implantable Neural Interfaces
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/biocas.2018.8584761
Publication URI: http://dx.doi.org/10.1109/biocas.2018.8584761
Type: Conference/Paper/Proceeding/Abstract