Integrated Devices for Micro-Package Integrity Monitoring in mm-Scale Neural Implants (2018)

First Author: Mazza F
Attributed to:  Empowering Next Generation Implantable Neural Interfaces funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/biocas.2018.8584761

Publication URI: http://dx.doi.org/10.1109/biocas.2018.8584761

Type: Conference/Paper/Proceeding/Abstract