Packaging degradation studies of High Temperature SiC MOSFET discrete packages (2020)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/ispsd46842.2020.9170030
Publication URI: http://dx.doi.org/10.1109/ispsd46842.2020.9170030
Type: Conference/Paper/Proceeding/Abstract