Packaging degradation studies of High Temperature SiC MOSFET discrete packages (2020)

First Author: Mouawad B

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ispsd46842.2020.9170030

Publication URI: http://dx.doi.org/10.1109/ispsd46842.2020.9170030

Type: Conference/Paper/Proceeding/Abstract