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Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si 3 N 4 substrates (2018)

First Author: Dai J

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/wipdaasia.2018.8734691

Publication URI: http://dx.doi.org/10.1109/wipdaasia.2018.8734691

Type: Conference/Paper/Proceeding/Abstract