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Deep learning enhanced digital twin for Closed-Loop In-Process quality improvement (2020)

First Author: Franciosa P

Attributed to: Self-Resilient Reconfigurable Assembly Systems with In-process Quality Improvement funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.cirp.2020.04.110

Publication URI: http://dx.doi.org/10.1016/j.cirp.2020.04.110

Type: Journal Article/Review

Parent Publication: CIRP Annals

Issue: 1