Deep learning enhanced digital twin for Closed-Loop In-Process quality improvement (2020)
Attributed to:
Self-Resilient Reconfigurable Assembly Systems with In-process Quality Improvement
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.cirp.2020.04.110
Publication URI: http://dx.doi.org/10.1016/j.cirp.2020.04.110
Type: Journal Article/Review
Parent Publication: CIRP Annals
Issue: 1