Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix (2018)
Attributed to:
Embedded Integrated Intelligent Systems for Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jmapro.2018.03.027
Publication URI: http://dx.doi.org/10.1016/j.jmapro.2018.03.027
Type: Journal Article/Review
Parent Publication: Journal of Manufacturing Processes