Molecular Complexes Featuring Unsupported Dispersion-Enhanced Aluminum-Copper and Gallium-Copper Bonds. (2020)
Attributed to:
Solution based CVD Approach to Metal Sulfide Thin Films
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1021/jacs.0c10099
PubMed Identifier: 33170691
Publication URI: http://europepmc.org/abstract/MED/33170691
Type: Journal Article/Review
Volume: 142
Parent Publication: Journal of the American Chemical Society
Issue: 47
ISSN: 0002-7863