NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS (2018)
Attributed to:
Imperial College London - Equipment Account
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1615/ihtc16.ctm.023451
Publication URI: http://dx.doi.org/10.1615/ihtc16.ctm.023451
Type: Conference/Paper/Proceeding/Abstract