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Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics (2019)

First Author: Bournias-Varotsis A

Attributed to: Embedded Integrated Intelligent Systems for Manufacturing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.addma.2019.100799

Publication URI: http://dx.doi.org/10.1016/j.addma.2019.100799

Type: Journal Article/Review

Parent Publication: Additive Manufacturing