Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics (2019)
Attributed to:
Embedded Integrated Intelligent Systems for Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.addma.2019.100799
Publication URI: http://dx.doi.org/10.1016/j.addma.2019.100799
Type: Journal Article/Review
Parent Publication: Additive Manufacturing