Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics (2021)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jmatprotec.2021.117056
Publication URI: http://dx.doi.org/10.1016/j.jmatprotec.2021.117056
Type: Journal Article/Review
Parent Publication: Journal of Materials Processing Technology