Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics (2021)

First Author: Tuo C
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmatprotec.2021.117056

Publication URI: http://dx.doi.org/10.1016/j.jmatprotec.2021.117056

Type: Journal Article/Review

Parent Publication: Journal of Materials Processing Technology