Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores (2021)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.cma.2021.113729
Publication URI: http://dx.doi.org/10.1016/j.cma.2021.113729
Type: Journal Article/Review
Parent Publication: Computer Methods in Applied Mechanics and Engineering