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Molecular simulation of thermoset curing: application to 3D printing materials (2020)

First Author: Jenei M

Attributed to: Topological Evolution of Polymer Networks funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1080/08927022.2020.1829613

Publication URI: http://dx.doi.org/10.1080/08927022.2020.1829613

Type: Journal Article/Review

Parent Publication: Molecular Simulation

Issue: 7