Ambiphilic Al-Cu Bonding. (2021)

First Author: Liu HY

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/anie.202104658

PubMed Identifier: 33899319

Publication URI: http://europepmc.org/abstract/MED/33899319

Type: Journal Article/Review

Volume: 60

Parent Publication: Angewandte Chemie (International ed. in English)

Issue: 26

ISSN: 1433-7851