Ambiphilic Al-Cu Bonding (2021)

First Author: Liu H

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/ange.202104658

Publication URI: http://dx.doi.org/10.1002/ange.202104658

Type: Journal Article/Review

Parent Publication: Angewandte Chemie

Issue: 26