Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices (2021)
Attributed to:
Empowering Next Generation Implantable Neural Interfaces
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1088/1361-6439/ac12a1
Publication URI: http://dx.doi.org/10.1088/1361-6439/ac12a1
Type: Journal Article/Review
Parent Publication: Journal of Micromechanics and Microengineering
Issue: 9