Thermal-Flow Network Modeling for Virtual Prototyping of Power Electronics (2021)
Attributed to:
Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2021.3095020
Publication URI: http://dx.doi.org/10.1109/tcpmt.2021.3095020
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 8