Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects (2022)

First Author: Liu C
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmapro.2021.10.065

Publication URI: http://dx.doi.org/10.1016/j.jmapro.2021.10.065

Type: Journal Article/Review

Parent Publication: Journal of Manufacturing Processes