Ultra-Thin Chips with Printed Interconnects on Flexible Foils (2021)
Attributed to:
'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1002/aelm.202101029
Publication URI: http://dx.doi.org/10.1002/aelm.202101029
Type: Journal Article/Review
Parent Publication: Advanced Electronic Materials
Issue: 5