Low thermal conductivity in a modular inorganic material with bonding anisotropy and mismatch. (2021)
Attributed to:
Integration of Computation and Experiment for Accelerated Materials Discovery
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1126/science.abh1619
PubMed Identifier: 34446603
Publication URI: http://europepmc.org/abstract/MED/34446603
Type: Journal Article/Review
Volume: 373
Parent Publication: Science (New York, N.Y.)
Issue: 6558
ISSN: 0036-8075