Characterization of Electrical-Thermal-Mechanical Deformation of Bonding Wires Under Silicone Gel Using LF-OCT (2021)
Attributed to:
Development of New Low Cost Point of Care Diagnostic Technologies for Diabetic Retinopathy in China
funded by
GCRF
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2021.3068128
Publication URI: http://dx.doi.org/10.1109/tpel.2021.3068128
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Power Electronics
Issue: 10