📣 Help Shape the Future of UKRI's Gateway to Research (GtR)

We're improving UKRI's Gateway to Research and are seeking your input! If you would be interested in being interviewed about the improvements we're making and to have your say about how we can make GtR more user-friendly, impactful, and effective for the Research and Innovation community, please email gateway@ukri.org.

Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding (2021)

First Author: Liang S

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2021.3108017

Publication URI: http://dx.doi.org/10.1109/tcpmt.2021.3108017

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 12