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PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping (2021)

First Author: Kumaresan Y

Attributed to: Engineering Fellowship for Growth - Neuromorphic Printed Tactile Skin (NeuPRINTSKIN) (Ext) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mee.2021.111588

Publication URI: http://dx.doi.org/10.1016/j.mee.2021.111588

Type: Journal Article/Review

Parent Publication: Microelectronic Engineering