PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping (2021)
Attributed to:
Engineering Fellowship for Growth - Neuromorphic Printed Tactile Skin (NeuPRINTSKIN) (Ext)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.mee.2021.111588
Publication URI: http://dx.doi.org/10.1016/j.mee.2021.111588
Type: Journal Article/Review
Parent Publication: Microelectronic Engineering