Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging (2021)

First Author: Liu C
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2021.114241

Publication URI: http://dx.doi.org/10.1016/j.microrel.2021.114241

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability