Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation (2021)

First Author: Su Y
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2021.114244

Publication URI: http://dx.doi.org/10.1016/j.microrel.2021.114244

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability