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Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing (2021)

First Author: Jevtics D

Attributed to: Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1364/ome.432751

Publication URI: http://dx.doi.org/10.1364/ome.432751

Type: Journal Article/Review

Parent Publication: Optical Materials Express

Issue: 10