Quantifying thermal transport in buried semiconductor nanostructures via cross-sectional scanning thermal microscopy. (2021)

First Author: Spièce J
Attributed to:  Future Compound Semiconductor Manufacturing Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1039/d0nr08768h

PubMed Identifier: 34114577

Publication URI: http://europepmc.org/abstract/MED/34114577

Type: Journal Article/Review

Volume: 13

Parent Publication: Nanoscale

Issue: 24

ISSN: 2040-3364