3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors (2021)
Attributed to:
Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2021.3072994
Publication URI: http://dx.doi.org/10.1109/tcpmt.2021.3072994
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 5