Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process (2021)

First Author: Dai J
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2021.3118323

Publication URI: http://dx.doi.org/10.1109/tdmr.2021.3118323

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 4