Ferroelectric/multiferroic self-assembled vertically aligned nanocomposites: Current and future status (2021)
Attributed to:
ECCS - EPSRC Development of uniform, low power, high density resistive memory by vertical interface and defect design
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1063/5.0035366
Publication URI: http://dx.doi.org/10.1063/5.0035366
Type: Journal Article/Review
Parent Publication: APL Materials
Issue: 3