Review on high heat flux flow boiling of refrigerants and water for electronics cooling (2021)
Attributed to:
Enhanced Multiscale Boiling Surfaces (EMBOSS): From Fundamentals to Design
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2021.121787
Publication URI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2021.121787
Type: Journal Article/Review
Parent Publication: International Journal of Heat and Mass Transfer