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Co-Package Technology Platform for Low-Power and Low-Cost Data Centers (2021)

First Author: Papatryfonos K

Attributed to: Future Compound Semiconductor Manufacturing Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.3390/app11136098

Publication URI: http://dx.doi.org/10.3390/app11136098

Type: Journal Article/Review

Parent Publication: Applied Sciences

Issue: 13