Co-Package Technology Platform for Low-Power and Low-Cost Data Centers (2021)
Attributed to:
Future Compound Semiconductor Manufacturing Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.3390/app11136098
Publication URI: http://dx.doi.org/10.3390/app11136098
Type: Journal Article/Review
Parent Publication: Applied Sciences
Issue: 13