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Monitoring Power Module Solder Degradation From Heat Dissipation in Two Opposite Directions (2022)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2022.3157464

Publication URI: http://dx.doi.org/10.1109/tpel.2022.3157464

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 8