Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network (2021)

First Author: Hu B

Attributed to: Vehicle Electrical Systems Integration (VESI) funded by UKRI

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2020.3045604

Publication URI: http://dx.doi.org/10.1109/tpel.2020.3045604

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 7